摘要
通过热风回流焊制备了Cu/Sn3.0Ag0.5Cu/Cu对接互连焊点,测试了未通电及6.5A直流电下通电36h和48h后焊点的剪切强度。结果表明,电迁移显著地降低了焊点的剪切强度,电迁移36h使剪切抗力降低约30%,电迁移48h降低约50%。SEM观察断口和界面形貌表明,界面金属间化合物增厚使断裂由韧性向脆性转变。
The Cu/Sn3.0Ag0.5Cu/Cu solder joints were prepared by hot wind reflow soldering technique.Shear strengths of varied specimens with no current action and current action at 6.5 A for 36 h and 48 h respectively,were tested.Results indicate that electromigration degrades the shear strength of the solder joints seriously.The resist shear forces of the joints reduce about 30% and 50% after current actions for 36 h and 48 h,respectively.It is observed that the transition of the failure mode from ductile to brittle is found due to IMC thickening by SEM observation.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2011年第2期29-31,共3页
Electronic Components And Materials
基金
广东省科技计划资助项目(No.2008A080403008-04)