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电迁移对Sn3.0Ag0.5Cu无铅焊点剪切强度的影响 被引量：8

Influence of electromigration on the shear strength of Sn3.0Ag0.5Cu Pb-free solder joint
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摘要 通过热风回流焊制备了Cu/Sn3.0Ag0.5Cu/Cu对接互连焊点,测试了未通电及6.5A直流电下通电36h和48h后焊点的剪切强度。结果表明,电迁移显著地降低了焊点的剪切强度,电迁移36h使剪切抗力降低约30%,电迁移48h降低约50%。SEM观察断口和界面形貌表明,界面金属间化合物增厚使断裂由韧性向脆性转变。 The Cu/Sn3.0Ag0.5Cu/Cu solder joints were prepared by hot wind reflow soldering technique.Shear strengths of varied specimens with no current action and current action at 6.5 A for 36 h and 48 h respectively,were tested.Results indicate that electromigration degrades the shear strength of the solder joints seriously.The resist shear forces of the joints reduce about 30% and 50% after current actions for 36 h and 48 h,respectively.It is observed that the transition of the failure mode from ductile to brittle is found due to IMC thickening by SEM observation.
作者 常红 李明雨
机构地区 哈尔滨工业大学深圳研究生院现代焊接生产技术国家重点实验室
出处 《电子元件与材料》 CAS CSCD 北大核心 2011年第2期29-31,共3页 Electronic Components And Materials
基金 广东省科技计划资助项目(No.2008A080403008-04)
关键词 电迁移 剪切强度 Sn3.0Ag0.5Cu electromigration shear strength Sn3.0Ag0.5Cu
分类号 TG425 [金属学及工艺—焊接]
  • 相关文献

参考文献13

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二级参考文献48

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共引文献31

同被引文献112

  • 1王惠平.SMT再流焊温度曲线对焊接质量的影响[J].青海大学学报（自然科学版）,2009,27(2):13-15. 被引量：6
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  • 3王大勇,顾小龙.Ni对Sn-0.7Cu焊料微观组织和力学性能的影响[J].电子工艺技术,2007,28(1):17-19. 被引量：12
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引证文献8

二级引证文献21

电子元件与材料
2011年 第2期

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