摘要
运用莱卡显微镜、X射线衍射仪及电化学测试系统等仪器设备,对(Sn-9Zn)-xBi(x=0,1,3和5)钎料组织性能进行研究。结果表明:当x小于5时,Bi可明显影响(Sn-9Zn)-xBi钎料中富Zn相尺寸及分布,钎料的熔化温度随Bi含量的增加而降低至188℃;钎料的润湿性随Bi含量增加而得到改善,其中以x在1～3为最明显;与Sn-9Zn钎料相比,当x为3时,钎料显微硬度提高了31%,达到最大值22.3HV;钎料腐蚀电位随x变化不大,但x为5时腐蚀电流密度却减小至未添加Bi的Sn-9Zn钎料的25%。
Microstructure and property of （Sn-9Zn）-xBi （x=0,1,3 and 5） solder were investigated by Leica microscope,XRD and electrochemical testing system and so on.The result show that the size and distribution of Zn-rich phase in the solder can be significantly effected with x 〈5,melting temperature is down to 188 ℃ with x increase,and wettability increases obviously with x increases,specially x of 1-3;comparing to Sn-9Zn,the microhardness of the solder increases by 31%,reaching to max.value of 22.3 HV,at x of 3 in the solder.Corrosion potential of the solder changes a little with x increase,however,corrosion current density of the solder with x of 5 reduces to 25% compared to Sn-9Zn solder.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2011年第2期32-35,共4页
Electronic Components And Materials
基金
辽宁省教育厅科学研究计划资助项目(No.20060505
No.2008382)
