微电子芯片热电冷却系统的传热特性

Heat transfer characteristics analysis on the TEC system of the microelectronic chip

针对微电子芯片热管理技术的现状和传统冷却技术的不足,建立微电子芯片热电冷却装置及其性能测试系统,采用热阻分析模型对传热过程进行研究。结果表明:在热电冷却过程中,帕尔帖效应占主导作用,TEC(热电冷却系统)自身热阻θ2随工作电流I的增大而降低。当芯片功率为20W时,芯片与TEC冷面的界面热阻θ1在I为2.1A时取得最小值0.461℃·W-1。系统总热阻θtotal随I的增大先减小后增大,当芯片功率为20W时,θtotal在I为2.1A时取得最小值0.344℃·W-1,系统的最佳工作电流和系统总热阻都随芯片功率的增加而增大。

Based on the research background and status of the thermal management technology for microelectronic chip,the microelectronic chip thermoelectric cooling equipment and its test system were developed.The thermal resistance analysis model was applied in research of the heat transfer process.The results show that when the thermoelectric cooling system is in normal operating condition,the Peltier effect is the dominant role in the thermoelectric cooling process.The thermal resistance θ2 of TEC decreases when the operating current I increases,the interface thermal resistance θ1 can obtain the minimum value 0.461 ℃·W^-1 when the chip power is 20 W and I is 2.1 A.The total thermal resistance θtotal firstly decreases and then increases with the increase of operating current I.θtotal may obtain the minimum value 0.344 ℃·W^-1 when the chip power is 20 W and I is 2.1 A.Furthermore,θtotal and optimum operating current both increase as the chip power increases.