期刊文献+

2024铝合金表面化学镀镍工艺研究 被引量:7

Study on the Process of Electroless Plating Nickel for 2024 Aluminum Alloy
下载PDF
导出
摘要 通过正交实验确定了2024铝合金表面化学镀镍合金层的镀液组成,并通过扫描电镜对镀层的表面形貌进行了观察,通过交流阻抗对镀层在3.5%NaCl溶液的耐蚀性进行了测试。实验结果表明,采用本溶液组成和工艺可以制备表面均匀平整、致密的Ni-P合金层,镀层与基体结合良好。同时,镀层的显微硬度约是基体的8.5倍,耐蚀性得到明显改善,具有良好的工业应用前景。 The bath composition of electroless plating Ni-P coating for 2024 aluminum alloy was studied using orthogonal experiment.The surface morphology was observed by scanning electron microscopy(SEM),and the corrosion resistance of Ni-P films was investigated by means of electrochemical impedance spectroscopy(EIS).The results show a compact and homogeneous coating with a good adhesion can be obtained by the bath.The microhardness of Ni-P coatings is 8.5 times greater than that of aluminum alloy,and the corrosion resistance of Al aluminum alloy is improved.Therefore,the Ni-P coating has a better prospect for application.
作者 梁平
出处 《铸造技术》 CAS 北大核心 2011年第1期97-99,共3页 Foundry Technology
关键词 铝合金 化学镀 NI-P镀层 耐蚀性 Aluminum alloy Electroless Ni-P coating Corrosion resistance
  • 相关文献

参考文献7

  • 1Fridlyander I N, Sister V G., Grushko O E, et al. Aluminum alloys: Promising materials in the automotive industry[J]. Metal Science and Heat Treatment,2002,44 (9-10): 365-370.
  • 2郭增昌,王云芳,王汝敏.航空铝合金防腐保护研究进展[J].材料导报,2005,19(9):71-75. 被引量:13
  • 3Andrieu C, Dalard F, Rameau J J, et al. Aluminum alloy corrosion detection by magnetic measurements[J].Journal of Materials Science,1998,33(12)..3 177-3 181.
  • 4Szklarska-Smialowska Z. Pitting corrosion of aluminum alloy[J]. Corrosion Science, 1999,41(9) : 1 743-1 767.
  • 5Saaoudi M, Chassaing E, Cherkaoui M, et al. Hydrogen incorporation in Ni-P films prepared by electroless deposition [J].Journal of Applied Electrochemistry, 2002,32(12):1 331-1 336.
  • 6崔国峰,李宁,黎德育,黄久贵,武刚,蒋丽敏.化学镀镍和镍/金在微电子领域中的应用及展望[J].电镀与环保,2003,23(4):7-9. 被引量:24
  • 7胡光辉,吴辉煌,杨防祖.镍磷化学镀层的耐蚀性及其与磷含量的关系[J].物理化学学报,2005,21(11):1299-1302. 被引量:25

二级参考文献80

  • 1K.Kordàs, L. Nànai, K. Bali. Thin Soild Film, 2001, 384:185-188.
  • 2A.F.J.Baggerman, J. F. J. M. Caers, J. J. Wondergen. Low Cost Flip-Chip on Board, IEEE Transactions on Components,Packaging, and Manufacturing Technology, Part B, 1996, 19:736-745.
  • 3A. A. Liu, H. K. Kim, K. N. Tu, and P. A. Totta. Spalling of Cu6Sn5 Spheroids in the Soldering Reaction of Eutectic SnPb on Cr/Cu/Au Thin Films [J]. Journal of Applied Physics, 1996,80 : 2774-2780.
  • 4C. Liu, D. A. Hutt, D. C. Whalley, P. P. Conway. Under Bump Metallisation of fine Pitch Flip-Chip Using Electroless Nickel Deposition [ J ]. Journal of Electronics Manufacturing, 2000, 10(3):161-170.
  • 5E. J. O' Sullivan et al. IBM J. Res. Develop, 1998, 42:607.
  • 6J. M. Calvert, G. S. Calabrese, J. F. Bohland, M. Chen, W.J.Dressick, C. S. Dulcey. J. Vac. Sci. Technol, 1994, B12:3884.
  • 7F. N. Cane, San Jose. Electroless Plating Process for Printed Circuit Boards [P]. U S Patent, 1997, 5648125.
  • 8K. Aoki, O. Takano. Plat Surf Finish, 1990, 77:48.
  • 9V. D. Papachristos, C. N. Panagopoulos, U. Wahlstrom, L.W.Christoffersen, P. Leisner. Mater Sci Eng, 2000, A 279:217.
  • 10T.Osaka, H. Sawai, F. Otoi, K. Nihei. Metal Finish, 1982,80:31.

共引文献58

同被引文献55

引证文献7

二级引证文献18

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部