摘要
应用ＤＳＣ和ＩＲ分析技术，研究了含有口恶硼杂环的硼胺络合物与环氧树脂体系的固化反应机理和固化反应动力学。结果表明，固化反应主要是硼胺络合物与体系中羟基化合物形成含氢质子的配位络合物，然后由此引发体系的环氧基进行的阳离子开环聚醚反应，整个体系的固化反应过程遵循一级动力学方程。
The curing mechanism and kinetics of epoxy resin with cured boron amine complexes containing oxaborinane were studied by means of DSC and IR. The results indicated that the first complexes containing hydrogen proton came into being only after the reaction of boron amine complexes with hydrogen groups of the system, and the polyether cross network was formed by initiation epoxy groups. The study of the curing kinetics reveals that the whole curing process follows the first order kinetics.
出处
《复合材料学报》
EI
CAS
CSCD
北大核心
1999年第4期52-57,共6页
Acta Materiae Compositae Sinica
基金
黑龙江省自然科学基金
关键词
硼胺络合物
环氧树脂
固化反应机理
动力学
boron amine complex, epoxy resin, curing kinetics, curing mechanism
