摘要
通过600℃/2 h真空退火,使复合电沉积的Ni-14.1 mass%Al膜(平均粒径为1μm)合金化,获得一种新型细晶Ni_3Al涂层.对比研究了该涂层与粗晶Ni_3Al合金900℃下50 h恒温氧化过程.结果表明,细晶涂层可快速生长连续Al_2O_3膜,导致NiO的生长受到明显抑制.与粗晶合金相比,该氧化膜粘附性更强.其原因可能在于氧化时细晶结构可抑制源自氧化膜的阳离子空位及Ni_3Al中因Al、Ni的互扩散所致的"Kirkendall"空位在氧化膜/基体界面沉积形成孔洞,提高了二者的结合强度.
A novel fine-grained Ni3Al coating was fabricated by annealing an electrodeposited Ni-14.1 mass%Al composite coating in vacuum at 600℃for 2 h.Oxidation of the coating was compared to that of a coarse-grained Ni3Al alloy at 900℃for 50 h and the result showed that the growth of NiO was significantly retarded on the coating because of a rapid formation of a continuous alumina scale.Moreover,the alumina scale on the coating was much adherent,because the existence of abundant grain boundaries in the coating inhibited the formation of cavities at the scale/metal interface due to condensation of cation vacancies injected from the growing scale and"Kirkendall"vacancies generated below scale because of the inter-diffusion between Al and Ni during oxidation.
出处
《腐蚀科学与防护技术》
CAS
CSCD
北大核心
2011年第1期1-4,共4页
Corrosion Science and Protection Technology