摘要
采用微生物技术、表面分析技术以及电化学测量技术,研究了从再生水环境中分离提纯得到的硫酸盐还原菌(SRB)的形态、生长规律,以及SRB对铜合金HSn701-AB在再生水环境中腐蚀的影响.结果表明,在再生水环境中SRB的生长曲线存在2d～3d的停滞期;铜合金HSn701-AB在接种SRB的再生水环境中浸泡3 d时,出现阻挡层扩散阻抗,随着浸泡时间的增长,腐蚀加重,20d时其表面生成致密的SRB生物膜.
The morphology and growth characters of sulfate reducing bacteria,which were separated from recycled water,and its effect on corrosion of copper alloy HSn701-AB in recycled water were investigated by means of microbiological technology,surface analysis technique and electrochemical impedance spectroscopy.The results showed that the growth of SRB had 2 d～3 d＇s lag phase in recycled water.After immersed in recycled water with SRB for 3 days,the copper alloy HSn701-AB showed features of barrier diffusion impedance,and with the immersion time increased,the corrosion of HSn701-AB became severe in company with formation of a dense SRB bio-film.
出处
《腐蚀科学与防护技术》
CAS
CSCD
北大核心
2011年第1期18-24,共7页
Corrosion Science and Protection Technology
关键词
硫酸盐还原菌
微生物腐蚀
铜合金
HSn701-AB
电化学阻抗谱
sulfate reducing bacteria
microbiological induced corrosion
copper alloy
HSn701-AB
electrochemical impedance spectroscopy
