摘要
随着绿色化学的发展,无铅钎料专用的水基免清洗助焊剂,在未来电子工业中具有重要的应用价值。本文比较各类型助焊剂,阐述了水基免清洗助焊剂的特点,综述了国内外科研工作者改善水基免清洗助焊剂性能的研究状况,并展望该领域未来的发展方向。
The water-based no-clean flux for lead-free solder will be wildly used in electronic industry,it's the inevitable trend for the green chemistry.Comparing with other types of flux,the characteristic of the water-based no-clean flux was described in the paper.The recent progress on improving the water-based no-clean flux by the domestic and international researchers was summarized,and the future development was prospected as well.
出处
《焊接技术》
北大核心
2011年第1期3-8,0-1,共6页
Welding Technology
基金
广东省科技计划项目(2010B0108000029)
关键词
水基
免清洗
助焊剂
钎焊性能
water-based,no-clean,flux,soldering properties
