期刊文献+

环氧树脂/AlN复合材料中气孔的形成与控制 被引量:3

Formation and Control of Stomtal in Epoxy Resin/AlN Composite
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摘要 采用不同粒径的氮化铝(A lN)粉末为填料,通过超声波分散及机械搅拌分散相结合的方式制备了环氧树脂/A lN复合材料。运用SEM对填料及气孔在基体中的分布情况进行表征分析,同时讨论超声波分散、真空脱泡及分散剂在材料成型过程中的消泡效果。结果表明:超声分散的应用不利于气孔率的减少,真空脱泡及消泡剂的添加能有效地减少材料中的气孔分布,提升材料的导热性能。 Ultrasonic dispersion and mechanical agitation were used to prepare epoxy resin/AlN composites using AlN powders with different sizes as fillers.SEM was used to characterize the distribution of fillers and stomtals of composites.The defoaming effect of ultrasonic dispersion,vacuum defoaming and dispersing agent in the material forming process was also discussed.Results showed that the application of ultrasonic dispersion was of no advantage for cutting down stomtal;both vacuum deforming and adding defoamer could reduce the distribution of the stomtal and enhanced the thermal conductivity of the composite.
出处 《塑料工业》 CAS CSCD 北大核心 2011年第1期81-84,共4页 China Plastics Industry
关键词 环氧树脂 氮化铝 复合材料 气孔 Epoxy Resin Aluminum Nitride Composite Stomtal
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参考文献7

  • 1孙曼灵.环氧复合材料及其应用技术基础简介[C]//中国环氧树脂应用技术学会.第十三次全国环氧树脂应用技术学术交流会论文集.天津:中国环氧树脂应用技术学会,2009:41-47.
  • 2沈源,傅仁利,何洪,韩艳春.氮化硅/环氧复合电子基板材料制备及性能[J].热固性树脂,2007,22(1):16-18. 被引量:12
  • 3NATHANIEL C, HASSAN M, VIJAYA K, et al. Infusion of SiC nanoparticles into SC -15 epoxy: an investigation of ther- mal and mechanical response [ J ]. Macromol Mater Eng, 2005, 290 : 423 - 429.
  • 4张洁,王炜,曾宪华,史运泽,樊慧庆.氮化铝颗粒增强聚合物基板材料的制备及介电性能研究[J].航空材料学报,2006,26(3):341-342. 被引量:5
  • 5刘庆华,李亚东.超细AlN填充环氧树脂热性能研究[J].传感器技术,2005,24(11):36-38. 被引量:11
  • 6XU Y S, CHUNG D D L, MROZ C. Thermal conductivity a- luminium nitride polymer material composites [ J ]. Compos- ites: Part A, 2001, 32 (12) : 1749 -1757.
  • 7NAGAI Y, LAI G C. Thermal conductivity of epoxy resin filled with particulate aluminium nitride powder [ J ]. J Ce- ram Soc Jpn, 1997, 105 (3) : 197 -200.

二级参考文献17

  • 1Wang Jia-jun,Yi Xiao-su.Preparation and the properties of PMR-type polyimide composites with aluminum nitride [J].Journal of Applied Polymer Science,2003,89:3913-3917.
  • 2Xu Yun-sheng,Chung D D L,Mroz C.Thermally conducting aluminum nitride polymer matrix composites [J].Composites,PartA,2001,(32):1749-1757.
  • 3Nagai Y,Lai G C.Thermal conductivity of epoxy resin filled with participate aluminum nitride powder[J].Journal of the Ceramic Society of Japan,1997,105 (3):197-200.
  • 4Bae J W,Kim W,Cho S H.The properties of A1N-filled epoxy molding compounds by the effects of filler size distribution[ J ].Journal of Materials Science,2000,35:5907-5913.
  • 5WELTMARKT,Duroplaste[J].kunstsoffe,2004,10:145-146.
  • 6真清武,フェ-ル树脂[J].强化ブラスチッフス,2005,51(7):2-6.
  • 7Tanisawa,Hidemi.Phenolic resin molding materials with good resistance and dimensimal precision:JP,2005048009[ P ].2005-02-24.
  • 8Kinmura,Yesutaka.phenolic resin molding,materials with good thermal stability and flowability:JP,2005281356[P].2005-10-13.
  • 9Watari K,Hirao K,Brito M E,et al.Hot isostatic pressing to increase thermal conductivity of Si3N4 ceramics[J].J.Mater.Res.,1999,14:1538-1541.
  • 10Maier G.Low dielectric constant polymers for microelectronics[J].Prog.Polym.Sci.2001,26:3-65.

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