铝带键合:小型功率器件互连新技术

Aluminum Ribbon: New Interconnect Technology for Small Power Devices

随着半导体封装尺寸日益变小,普遍应用于大功率器件上的粗铝线键合技术不再是可行的选择。新近推出的铝带键合突破了封装尺寸的限制,实现了小功率器件封装中键合工艺的强度和性能优势。铝带键合提供了一个近乎完美的技术替代,且比现有技术更具吸引力。文中介绍了铝带键合工艺技术,着重关注其在小型分立器件中的应用。就SOL8和更小型无引脚封装的性能和制造能力,从键合质量、工艺能力以及设计要求等方面对其展开讨论,并与现有技术进行性能和成本的比较,可发现其技术能力和潜力。

As the semiconductor package smaller and thinner,the most commonly used interconnect technique in larger power devices,thick Aluminum wire bonding,was so far not a viable alternative.The recently introduced Aluminum ribbon bonding overcomes the package size restrictions and allows the application of the strengths and benefits of the thick Aluminum wire bonding process in smaller power devices.Aluminum ribbon bonding offers a near perfect fit and a very attractive alternative to the established techniques.This paper presents Aluminum ribbon bonding technique process,with a focus on its application in small power devices.Bond quality and process capability as well as design requirement to address performance and manufacture ability aspects in SOL8 and smaller leadless packages will be discussed.Performance and cost comparisons with the established techniques,we can find the technology＇s capabilities and potential.