摘要
为了在满足最低可靠性要求的同时尽量提升IC的成品率,基于缺陷的泊松分布模型及负二项分布模型研究了由缺陷引起的IC可靠性和成品率这两者之间的关系,并分别建立了相应的成品率-早期可靠性关系模型。基于成品率-可靠性模型,针对氧化层缺陷模型,采用模拟运算的方法,得到了随时间变化的成品率-可靠性关系模型。模型表明,在满足最低可靠性要求的同时,合理设计老化实验参数,可以最大限度地提高成品率,降低IC制造成本。最后根据这一模型对IC老化筛选实验的参数选择提出了优化的建议。
In order to maximize the yield of IC and meet the minimum reliability, the relationship between reliability and yield of IC based on the Poisson and negative binomial distribution is studied, and then the model of yield and early reliability is constructed respectively. Based on this model and the model of oxide defect, a model of yield and early reliability varying with time is obtained by the simulation method. The model presents that yield can be enhanced and reliability can be satisfied by designing proper burn-in parameters, which can decrease the cost of the IC manufacturing. The parameter choice of burn- in screening technology under the model of reliability and yield is proposed.
出处
《现代电子技术》
2011年第2期96-98,102,共4页
Modern Electronics Technique
关键词
缺陷
可靠性
成品率
老化
defect
reliability
yield
burn-in
