期刊文献+

高频电容器充电电源绝缘栅双极晶体管吸收电路 被引量:6

Absorption circuit of insulated gate bipolar transistor for high-frequency capacitor charging power supply
下载PDF
导出
摘要 高频化是提升电源功率密度的有效方法。为了保护高频电容器充电电源中的开关器件,以串联谐振式电容器充电电源为基础,研究了绝缘栅双极晶体管(IGBT)尖峰电压的产生机理及影响因素。介绍了几种抑制尖峰电压的方法,着重分析了IGBT吸收电路的基本原理,并进行了参数设计。结合仿真软件,对吸收电路的参数进行了优化,将仿真结果和40 kW,50 kHz电容器充电电源样机的实验结果进行对比,验证了提出方案的可行性。 Enhancing frequency is an effective method to enhance the power density of a power supply.In order to protect switching devices in the high-frequency capacitor charging power supply(CCPS),the mechanism and influencing factors of reverse peak voltages were investigated based on the series resonant capacitor-charging power supply.Several methods to inhibit the peak voltages were introduced.Fundamental principles of absorption circuit were analyzed,and circuit parameters were selected and optimized by simulation.Then the feasibility of absorption circuit was verified by the test of a 40 kW/50 kHz capacitor-charging power supply.
出处 《强激光与粒子束》 EI CAS CSCD 北大核心 2011年第1期239-243,共5页 High Power Laser and Particle Beams
基金 国家自然科学基金项目(50777061) 电力系统及发电设备控制和仿真国家重点实验室开放课题(SKLD09KM15)
关键词 电容器充电电源 吸收电路 尖峰电压 绝缘栅双极晶体管 逆变器 高频电源 capacitor charging power supply absorption circuit peak voltage insulated gate bipolar transistor inverter high-frequency power supply
  • 相关文献

参考文献17

二级参考文献54

共引文献242

同被引文献32

  • 1张全柱,黄成玉,邓永红.逆变器用IGBT吸收电路的Matlab仿真研究[J].电气传动自动化,2009,31(6):27-31. 被引量:8
  • 2苏建仓,王利民,丁永忠,宋晓欣.串联谐振充电电源分析及设计[J].强激光与粒子束,2004,16(12):1611-1614. 被引量:59
  • 3查申森,郑建勇,苏麟,吴恒荣,陈军.大功率IGBT并联运行时均流问题研究[J].电力自动化设备,2005,25(7):32-34. 被引量:25
  • 4王京峰,孙纯祥.基于DSP的永磁无刷直流电动机速度控制[J].微电机,2006,39(1):69-72. 被引量:19
  • 5Kouznetsov V, Macak K, Schneider J Met al. A novel pulsed magnetron sputter technique utilizing very high target power densities [J]. Surface and Coatings Technology. 1999, 122(2): 290-293.
  • 6Helmersson U, Lattemann M, Bohlmark J et al. Ionizedphysical vapor deposition (IPVD): A review of technology and applications [J]. Thin Solid Films. 2006, 513(1-2): 1-24.
  • 7Boo J H, Jung M J, Park H K et al. High-rate deposition of copper thin films using newly designed high-power magnetron sputtering source [J]. Surface and Coatings Technology. 2004, 188: 721-727.
  • 8Anders A, Andersson J, Ehiasarian A. High power impulse magnetron sputtering: Current-voltage-time characteristics indicate the onset of sustained self-sputtering [J]. Journal of Applied Physics. 2007, 102(11): 113303.
  • 9Lyshevski S E. High torque density integrated electro mechanical flight actuators [ J ]. IEEE Transactions on Aerospace and Elec- tronic System, 2002, 38 (1) : 174-182.
  • 10PENG F Z,SU G J, TOLBERT L M.A passive soft-switching snubber for PWM inverters [ J ] .IEEE Trans on Power Electronics,2004,19(2): 363-370.

引证文献6

二级引证文献16

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部