摘要
通过机械加工使硬脆材料达到亚微米级的平面度,纳米级的粗糙度是非常困难的,而广泛应用于IC加工领域的化学机械抛光(CMP)则能够实现工件的高精度加工要求。为此,设计了一台高精度的CMP试验装置,该装置用触摸屏完成人机对话,PLC作为整个测控系统的核心控制部分,通过接口完成数字、模拟信号的采集和对执行机构的控制,结构上具有结构简洁、控制方便的特点。在该装置上加工的直径100mm的不锈钢工件,平面度和粗糙度均达到或超过了设计要求。
It is very difficult that hard brittle materials reach sub-micron planar degree and nanoscale roughness by mechanical processing.Chemical machinery polishing widely used in the field of IC processing can achieve precision machining requirements of the workpiece.Therefore,a high-precision CMP test device is designed,this device cmplete man-machine dialogue with touch screen,PLC as the core control,digital and analog signal acquisition and the control of actuators through the interface,the characteristics of the device is structure compact and easy control.In this device process the stainless steel workpiece of Φ100mm,planar degree and roughness meet or exceed the design requirement
出处
《组合机床与自动化加工技术》
北大核心
2011年第1期105-108,共4页
Modular Machine Tool & Automatic Manufacturing Technique
基金
中国工程物理研究院科学技术发展基金资助(2008B0203016)
关键词
试验装置
化学机械抛光
全局平面化
人机对话
可编程控制器
test device
chemical mechanical polishing（CMP）
global planarization
man-machine dialogue
programmable controller（PLC）
