离子束溅射铜钨薄膜的结构

Structure of Ion Beam Sputtered Copper-Tungsten Film

为了进一步探讨离子束溅射铜钨薄膜的结构,在铁片上离子束溅射铜钨薄膜,研究了轰击离子束能量及低能辅助轰击方式对薄膜相结构和厚度的影响。结果表明:随轰击铜靶离子束能量增加,钨由近似非晶亚稳态转变成晶态;由于溅射粒子落到基片前的反射效应,薄膜中间比边缘薄,且随轰击铜靶离子束能量增加,薄膜变薄到一定程度时开始增厚;当使用低能辅助轰击时,原子喷丸效应使薄膜难以沉积。

Cu-W film was prepared on the surface of iron by ion beam sputtering.The effects of Ar+ beam energy and low-energy assisted sputtering mode on the phase structure and thickness of as-sputtered Cu-W film were investigated.It was found that W in the Cu-W film was transformed from almost amorphous metastable state to crystalline state.The sputtered particles experienced reflecting effect before reaching the substrate,resulting in thinning of central zone.The film began to thicken when it was thinning to some extent.When low-energy assisted sputtering mode was used,atomic shot peening effect made Cu-W film infeasible to deposit.