银基透明导电多层膜界面研究进展

Ag-based transparent conducting multilayer thin films:the role of interfaces

由于具有较低的电阻率和成本、较好的机械加工性能、设计上的灵活性,可室温沉积等优点,银基透明导电多层膜已广泛应用于低辐射膜、强电磁屏蔽、低功耗光电子器件特别是柔性电子器件等领域。但由于材料自身的性质与制备条件的差异性,实际制备的金属/电介质(或半导体)透明导电多层膜界面处往往存在表面等离子体共振、界面导电电子散射、膜层脱层开裂等问题,这些均与多层膜界面特性密切相关。本文针对这类问题,评述了近年来银基透明导电多层膜界面研究的进展,并对今后发展给予分析和展望。

Ag-based transparent conducting multilayer thin films have been widely applied to low-E windows, high-performance electromagnetic shielding, low power-consuming optoelectronic devices due to comparatively low sheet resistance, low deposition temperature, cost-effective raw materials and good mechanical process abil- ity. Several disadvantages, such as strongly surface plasmon resonance at the interface between the metal and dielectric layers, strongly scattering for conducting electrons from rough interfaces, delaminating cracking in the multilayer have been found in the fabricating and serving processes. In this paper, several problems involved and recent progress recently would be reviewed from different points of view. Finally, prospects in this field were suggested for the future.