军用电子产品封存期间失效分析

Analysis on Failure of Military Electronic Products During the Sealing Time

分析了相关的试验和资料,考察了温湿度、静电干扰等多种因素对电子产品封存失效的作用机理,有利于提高军用电子产品的封存质量从而提高其战时可靠性。

Inspected various factors of electronic products failure mechanism in seal such as temperature and humidity,electrostatic interference,etc.,improve the quality of military electronic product seal and thus improve their wartime reliability.