印制电路板中微埋盲孔的研究进展

Research Process on Micro Buried/blind Via in Printed Circuit Board

概述了国内外微埋盲孔制作的最新研究成果,主要包括微埋盲孔钻孔工艺、去钻污工艺以及孔金属化研究等;重点介绍了激光钻孔技术、微孔填铜技术的发展及应用;并提出了今后的研究方向。

The latest researches on micro buried/blind via at home and abroad are reported, the micro via drill process, via cleaning process and hole metallization technology included. The main points are the use and development of laser drill technology and micro via copper filling process. The research directions for the future are suggested.