小型断路器用AgWNi触头材料的研制

Research on the Preparation of AgWNi Contact Material Used in Miniature Circuit Breaker

采用粉末冶金熔渗工艺制备AgWNi触头材料,研究了材料的烧结行为以及添加元素Ni对材料性能的影响。用Archimede法测量样品密度,并对材料的显微组织进行了分析。结果表明,Ni可有效改善Ag与W的润湿性,使材料获得较高的致密度。与AgW55材料相比,其相对密度可达到98%~99%（提高约1.23%）,硬度提高14.48%,电阻率降低3.9%。

AgWNi contact material was prepared by infiltration method.Sintering behavior of AgWNi and effect of Ni additive on physical and mechanical properties were studied.Density of contact material was investigated by Archimede and microstructure was researched by microscope and SEM.The results show that wettability of Ag-W was improved obviously by addition of Ni.Compared to AgW55 contact material,the hardness was increased by 14.48%,98%～99% of relative density was obtained（increased by 1.23%） and resistivity was decreased by 3.9%.