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基于MEMS技术的薄膜残余应力检测技术

Thin-film residual stress detection method based on MEMS technology
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摘要 薄膜材料在制备中都会产生一定的残余应力,而薄膜中残余应力的大小对整个微机电系统的性能和可靠性具有很大的影响.讨论了几种典型的残余应力检测方法,并分析了各自的特点.在此基础上,提出了一种整合微指针结构驱动器和测量探针的新型残余应力测试方法.其核心是设计出一种基于扫描探针的薄膜残余应力在线检测系统. Various kinds of thin film materials are widely applied in MEMS,but the thin film materials can have certain residual stress in the preparation.The thin film residual stress has the very tremendous influence on the MEMS performance and the reliability.This article introduces several typical residual stress detection methods and has analyzed their characteristics.The author proposes one kind of conformity micro indicator of the structure driver and measuring probe of new residual stress test system.Its key is the introduction of the overall design content,based on scans probe's thin film residual stress detection system.
作者 王海 童云华
出处 《安徽工程科技学院学报(自然科学版)》 2010年第4期54-57,共4页 Journal of Anhui University of Technology and Science
基金 安徽省高校青年教师基金资助项目(2008jq1080) 安徽省高校自然科学基金资助项目(kj20098119)
关键词 薄膜材料 残余应力 检测方法 thin film material residual stress detection method
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参考文献18

  • 1徐泰然.MENS和微机电系统-设计与制造[M].北京:机械工业出版社,2003.
  • 2H Guckel,T Randazzo,D W Burns.A Simple Technique for the Determination of Mechanical Strain in Thin Films with Application to Polysilicon[J].Journal of Apply Physical,1985(57):1671-1675.
  • 3W Fang,J A Wickert.Post-Buckling of Micromachined Beams[J].Journal of Micromechanics and Microengineering,1994(4):182-187.
  • 4H Guckel,D W Burns,C Rutigliano,et al.Diagnostic Microstructures for the Measurement of Intrinsic Strain in Thin Films[J].Journal of Micromechanics and Microengineering,1992(2):86-95.
  • 5J F L Goosen,B P Drieenhuizen,P J French,et al.Comparison of Techniques for Measuring Both Compressive and Tensile Stress in Thin Films[J].Sensors and Actuators A,1993(37-38):756-765.
  • 6L L Chu,L Que,Y B Gianchandani.Measurements of Material Properties Using Differential Capacitive Strain Sensors[J].Journal of Micro Electro Mechanical Systems,2002(11):489-498.
  • 7L B Wilner.Strain and Strain Relief in Highly Doped Silicon[J].Solid-State Sensor and Actuator Workshop,1992:22-25.
  • 8P J French,B P Drieenhuizen,D Poenar,et al.The Development of a Low-Stress Polysilicon Process Compatible with Standard Device Processing[J].Journal of Micro Electro Mechanical Systems,1996(5):187-196.
  • 9L Que,J S Park,Y B Gianchandani.Bent-Beam Electro-Thermal Actuators for High Force Applications[J].Journal of Micro Electro Mechanical Systems,1999:31-36.
  • 10L Que,J S Park,M H Li,et al.Reliability studies of bent-beam electro-thermal actuators[J].Reliability Physics Symposium,2000:118-122.

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