高温高压烧结金刚石-铜复合材料的研究

Investigation on diamond-Cu composites prepared by HTHP sintering process

采用高温高压烧结工艺制备了金刚石体积分数为80%的金刚石-铜复合材料。研究了金刚石颗粒大小、烧结温度、烧结时间等因素对复合材料成分、界面状态和热导率的影响。结果表明:金刚石颗粒直径为80μm时,在高温高压条件下可获得热导率高达639 W.m-1.K-1的金刚石-铜复合材料。当金刚石体积分数一定时,存在一临界粒径,随金刚石颗粒直径增大复合材料热导率先增大后减小。恰当的烧结温度和时间有助于获得黏结良好的界面和高热导率。

Diamond composites with diamond volume fraction up to 80% is prepared by high temperature and high pressure（HTHP）sintering method. Factors including particle size, sintering temperature and sintering time are investigated to illustrate the influence on composition, interracial state and thermal conductivity of the composites. The results indicates that a high thermal conductivity value of 639 W · m^-1 K^-1 could be achieved when diamond panicle diameter is 80 μm . A critical diameter value is determined by the volume fraction of diamond, and the thermal conductivity of the composite increases with the particle diameter increasing and then tends to decrease when it reaches the critical value. An optimal match of sintering temperature and sintering time is beneficial for a good cohesion at the interface and good thermal conductivity of the composites.