摘要
介绍了硅－玻璃静电键合的基本原理，阐述了在自建静电键合设备上实现静电键合的过程。结合其在微机械传感器中的应用，讨论了粗糙表面的键合技术。
The theory of siliconglass electrostatic bonding is firstly introduced.Then a selfestablished setup is described and its features are specified.The bonding mechanism in the setup is studied in detail.Finally,the process conditions of rough surfaces are discussed in terms of application in fabricating micromechanical sensors and satisfied bonding results are achieved.
出处
《半导体技术》
CAS
CSCD
北大核心
1999年第4期19-23,共5页
Semiconductor Technology
