瓷套粘接用胶粘剂配方及固化工艺的研究

The Research on the Adhesives Formula Applied and Firming Technology in Bushing Adhering

以高温固化型环氧树脂胶黏剂作为瓷套粘接用的胶黏剂,通过在配方中加入触变环氧树脂与气相二氧化硅所组成的复合触变剂,实现在固化过程中调整胶黏剂流变性(触变性)的目的,从而使固化过程中的胶黏剂不随时间及温度的增加而改变初始时的涂抹形状,满足了粘接面处所需的胶粘剂重量,对保证粘接产品的质量起到了重要作用。实验结果表明:常温下粘接接口的弯曲强度不低于100 MPa,完全满足瓷套对粘接口不低于80 MPa的要求。同时对粘接口进行了冷热循环、盐水煮实验,结果表明,接口处的粘接强度未见下降,满足产品的使用要求。

High temperature solidify type epoxy resin is used as the adhesives for bushing adhering, for realizing adjusting thixotropy of adhesives by adding composite thixotropic agent composed by thixotropic epoxy resin and gaseous phase silicon dioxide into the formula, adhesives keep initial daub- ifig form which not change with the increase of time and temperature in the firming process, the weight of adhesives needed by the glue interface, which played an important role to ensure the quality of adhe- sive products. The test results shows that： under common temperature the intensity of glue interface is not less than 100 MPa, the required intensity of 80 MPa from the bushing is satisfied.At the same time thermal cycling and boiling in salt solution test is taken on the glue interface, the result shows that, the intensity of the glue interface is not decline, the request of the product is satisfied.