建立封装芯片热阻网络模型的方法研究

Study on Methodology of Building Thermal Resistor Network Model for Packaged Component

针对电子设备系统级热分析中封装芯片模型复杂程度与计算精度的矛盾,引入热阻网络法,替代系统级分析中封装芯片的详细物理模型;并以某PBGA封装芯片为例,进行两种建模方法的对比分析,同时介绍一种快速确定网络中热阻值的方法。结果表明,热阻网络等效方法具有模型简单、分析快速、准确度高的优点,在系统级热分析中可完全替代详细的物理模型。

To deal with the conflict between complexity and accuracy of component modeling in system level thermal analysis for electronic equipments,thermal resistor network was used to replace detailed physical modeling of packaged IC in system level analysis.With a real PBGA component as an example,a comparison was made between the two methods.And a novel approach to quickly and conveniently fixing values of thermal resistors in the network was described.Results showed that the thermal resistor network features simple,fast and precise modeling.Therefore,it is replaceable for detailed physical modeling in system level thermal design.