摘要
采用LTCC技术,可以获得替代采用硅或其他技术制作的微功能结构,简化工艺,降低成本。重点研究了内嵌三维(3D)微流道系统LTCC多层基板成型中的关键技术:热压和烧结,并进行工艺优化。利用优化的热压、烧结工艺参数,可制备出完好的3D微流道系统LTCC多层基板;通过实验验证,LTCC内嵌三维微流道系统取得了良好的散热效果。
The micro-functional structure is fabricated by the LTCC technology instead of the silicon and other technology,which can simplify the process and reduce the cost.The critical manufacturing techniques of LTCC multi-layer substrate with micro-channel system embedded： lamination and sintering are studied mainly,and the processes are optimized.The intact LTCC substrate with the micro-channel system embedded can be fabricated precisely using the optimized lamination and sintering process parameters,and the good heat dissipation effect is obtained.
出处
《中国电子科学研究院学报》
2011年第1期20-23,共4页
Journal of China Academy of Electronics and Information Technology
关键词
LTCC
三维微流道
热压
烧结
散热
LTCC
3D micro-channel
lamination
sintering
heat dissipation
