无铅波峰焊接工艺的响应曲面优化法优化研究

Process of Lead-free wave soldering optimizing using Response Surface Methodology

利用响应曲面法(RSM)优化无铅波峰焊接工艺,通过前期的部分因子实验设计筛选出了显著因子,分别是助焊剂量、浸锡时间和轨道倾角。实验结果表明:提取的最佳条件是助焊剂量为77.5μg/cm2、浸锡时间为2.3 s和轨道倾角为6.3°。利用最佳操作条件可使波峰焊接缺陷率在10×10-4以下。

Response surface methodology（RSM） was applied to optimize the process of lead-free wave soldering.The effects of six factors was selected by a factional design,namely the mount of flux,the dwell time,the angle of conveyor.The result of experiment shows that the optimized parameters are follows： the mount of flux is 77.5 μg/cm2,the dwell time is 2.3 s and the angle of conveyor is 6.3°.The defects of lead-free wave soldering under these parameters can be controlled in 10×10-4.