摘要
在通讯设备中,有一类电源必不可少,这就是模块电源,在通讯产品集成度越来越高的前提下,模块电源也面临着同样的集成度不断提高的要求。如何在高集成度下实现产品的构成及高功率密度下达到散热要求,成为模块电源实现的瓶颈,本文就这些问题提出一些常用的解决办法。
In communications-equipment,there is a requisite part--power module.Under the circumstances of more and more integration level in communication products,power modules are required to be in compliance to the level and to be more integrated also.How to implement the structure under the condition of high integration and the heat dissipation under the high power density is becoming a choke point of power module design.Put forward some common methods to deal with the question mentioned above for reference.
出处
《电子工艺技术》
2011年第1期28-30,共3页
Electronics Process Technology
关键词
模块电源
铝基板
结构工艺
Power Module
Aluminium Carrier
Structure techniques