微立体光刻中光敏树脂特性的实验研究

Determination of the Characteristics of Photosensitive Resin in Microstereolithography

微立体光刻技术是基于快速原型制造技术思想的新型微细加工技术。在微立体光刻制造中,光敏树脂在一定波长的光照下发生固化反应,光敏树脂的曝光量阈值和透射深度是光敏树脂的两个重要的特性参数。对掺入质量比20%氧化硅纳米颗粒自行制备的光敏树脂的两种特性值进行测试研究,测量得到光敏树脂在氮气环境中比与在空气中的曝光量阈值小,分别为5.6 mJ/cm2以及86.5 mJ/cm2;加入光吸收剂后的透射深度比不加入光吸收剂的透射深度小,分别为14以及60。根据测量的树脂的特性值,使用实验室开发的微反射镜动态掩膜微立体光刻系统,成功制作微齿轮。

Microstereolithography is one of micro-fabrication technologies developed from traditional stereolithography.In uSL,the resin will be cured in certain light,the critical exposure（Ec） and the penetration depth（Dp） are two important parameters.The critical exposure and the penetration of the photosensitive resin which mixed with nanosilica at 20 wt% were determined,the critical exposure of the photosensitive resin in the N2 is less than its in air,are 86.5 mJ/cm^2 and 5.6 mJ/cm^2 respectively.The penetration of the photosensitive resin with doping is less than that without doping,are 60 um and 14 um respectively.According to the two values,a micro-gear is fabricated by projection microstereolithography system using digital micro mirror dynamic mask.