摘要
在780~980℃的温度下对TC21钛合金进行5~90min的扩散连接,研究接头的界面结合率、变形率、微观组织及微观硬度。结果表明,在连接温度为880℃、连接时间为15~30min的情况下,可以获得高质量的连接接头。接头的微观硬度随着连接温度的升高而增加,并在连接时间达到90min时取得峰值(HV367)。在连接温度为780~880℃、930℃和980℃时,分别观察到了全等轴组织、双态组织和全层片组织。α相的体积分数随着温度的升高和时间的延长而增加,并在880℃、60min时取得极值。
Diffusion bonding of TC21 titanium alloy was carried out at temperature ranging from 780 ℃ to 980 ℃ for 5-90 min.The interfacial bonding ratio,deformation ratio,microstructures and microhardness of the diffusion bonded joints were investigated.Results show that joints with high bonding quality can be obtained when bonded at 880 ℃ for 15?30 min.The microhardness increases with increasing the bonding temperature,while it has a peak value(HV367) when bonding time is prolonged up to 90 min.Fully equiaxed microstructures,bi-modal microstructures and fully lamellar microstructures were observed when bonded in temperature range of 780-880 ℃,at 930 ℃ or 980 ℃,respectively.The volume fraction of α phase first increases and achieves the maximum when bonded at 880 ℃ for 60 min,and then descended.
基金
Project(2010CB731704)supported by the National Basic Research Program of China
the Northwest Institute for Non-ferrous Metal Research of China for the support
关键词
TC21钛合金
扩散连接
微观组织
界面质量
TC21 titanium alloy
diffusion bonding
microstructure
interfacial quality