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Thermodynamic optimization of Bi-Ni binary system 被引量:1

热力学优化Bi-Ni二元系(英文)
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摘要 Based on the available experimental data,the Bi-Ni binary system was optimized thermodynamically by the CALPHAD method.The solution phases,including liquid,fcc_A1(Ni) and rhombohedral_A7(Bi),were described as substitutional solution phases,of which the excess Gibbs energies were expressed with the Redlich-Kister polynomial.The intermetallic compound,BiNi,was modeled using three sublattices(Bi)(Ni,Va)(Ni,Va) considering its crystal structure(NiAs-type) and the compatibility of thermodynamic database in the multi-component systems,while Bi3Ni was treated as a stoichiometric compound.Finally,a set of self-consistent thermodynamic parameters formulating the Gibbs energies of various phases in this binary system were obtained.The calculated results are in reasonable agreement with the reported experimental data. 基于文献报导的实验数据,采用相图计算(CALPHAD)方法,热力学优化了Bi-Ni二元系相图。该二元系的液相、fcc_A1(Ni)相和rhombohedral_A7(Bi)相用替换溶液模型来描述,其过剩吉布斯自由能用Redlich-Kister多项式来表达。考虑到晶体结构(NiAs型)以及与多组元体系热力学数据库的兼容性,中间化合物BiNi相采用亚点阵模型:(Bi)(Ni,Va)(Ni,Va);Bi3Ni相处理为化学计量比化合物。最后,通过优化该二元系实测的相图和热力学数据,获得一组能够表达各相吉布斯自由能的自洽的热力学参数。根据这些热力学参数计算的相图和热力学数据与报导的实验数据吻合良好。
出处 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2011年第1期139-145,共7页 中国有色金属学报(英文版)
基金 Projects(50371104,50771106and50731002)supported by the National Natural Science Foundation of China Project(2008K22)supported by the Scientific Research Foundation of Hunan Provincial Department of Land&Resources,China Project supported by Geology Exploration Foundation of Hunan Provincial Department of Land&Resources,China
关键词 Sn-based alloy phase diagram THERMODYNAMICS CALPHAD Bi-Ni binary system 锡基合金 相图 热力学 相图计算 Bi-Ni二元系
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  • 1李福泉,王春青,田德文,田艳红,P.Liu.SnPb钎料熔滴与Au/Ni/Cu焊盘的反应过程[J].中国有色金属学报,2004,14(7):1139-1143. 被引量:5
  • 2黄永章,袁文霞,乔芝郁.Ni-Sb二元合金的相关系与热力学性质的研究[J].稀有金属,2004,28(4):707-710. 被引量:3
  • 3[1]Zeng K, Kivilahti J K. Use of multicomponent phase diagrams for predicting phase evolution in solder/conductor systems[J]. Journal of Electronic Materials, 2001, 30(1): 35-44.
  • 4[2]Kattner U R, Handwerker C A. Calculation of phase equilibria in candidate solder alloys[J]. Z Metallkd, 2001, 92: 1-12.
  • 5[3]Gayle F W, Becka G. High temperature lead-free solder for microelectronics[J]. JOM, 2001, 6: 17-21.
  • 6[4]Frear D R, Jang J W. Pb-free solder for flip-chip interconnects[J]. JOM, 2001, 6: 28-32.
  • 7[5]Lee B J. Prediction of interfacial reaction products between Cu and various solder alloys by thermodynamics calculation[J]. Acta Mater, 1997, 45(5): 1867-1874.
  • 8[6]Kirkady J S, Young D J. Diffusion in the Condensed State[M]. London: The Institute of Metals, 1987.
  • 9[7]Moon K W, Boetinger W J, Kattner U R, et al. Experimental and thermodynamics assessment of Sn-Ag-Cu solder alloys[J]. Journal of Electronic Materials, 2000, 29(10): 1122-1136.
  • 10[8]Saunders N, Modwnik A P, CALPHAD--A Comprehensive Guide [M]. Lausanne Switzerland, Pergamon, 1998.

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