摘要
This paper describes a novel divide-by-32/33 dual-modulus prescaler （DMP）. Here, a new combination of DFF has been introduced in the DMP. By means of the cooperation and coordination among three types, DFF, SCL, TPSC, and CMOS static flip-flop, the DMP demonstrates high speed, wideband, and low power consumption with low phase noise. The chip has been fabricated in a 0.18μm CMOS process of SMIC. The measured results show that the DMP＇s operating frequency is from 0.9 to 3.4 GHz with a maximum power consumption of 2.51 mW under a 1.8 V power supply and the phase noise is -134.78 dBc/Hz at 1 MHz offset from the 3.4 GHz carrier. The core area of the die without PAD is 57 x 30 #m2. Due to its excellent performance, the DMP could be applied to a PLL-based frequency synthesizer for many RF systems, especially for multi-standard radio applications.
This paper describes a novel divide-by-32/33 dual-modulus prescaler （DMP）. Here, a new combination of DFF has been introduced in the DMP. By means of the cooperation and coordination among three types, DFF, SCL, TPSC, and CMOS static flip-flop, the DMP demonstrates high speed, wideband, and low power consumption with low phase noise. The chip has been fabricated in a 0.18μm CMOS process of SMIC. The measured results show that the DMP＇s operating frequency is from 0.9 to 3.4 GHz with a maximum power consumption of 2.51 mW under a 1.8 V power supply and the phase noise is -134.78 dBc/Hz at 1 MHz offset from the 3.4 GHz carrier. The core area of the die without PAD is 57 x 30 #m2. Due to its excellent performance, the DMP could be applied to a PLL-based frequency synthesizer for many RF systems, especially for multi-standard radio applications.
