电解铜箔表面结构及性能影响因素

Surface structure and performance of electrolytic copper foils

对铜箔进行化学处理,考察阴极钛辊表面粗糙度及阴极钛辊的腐蚀对铜箔的性能及表面图像影响。研究结果表明:增加处理液中Cu2+浓度及提高电流密度,有利于表面粗糙度增加,抗剥离强度增大,蚀刻因子Ef降低。若同时降低浸泡复合液中Cu2+和Zn2+浓度,增加Sb2+浓度,则表面粗糙度及抗剥离强度降低,蚀刻因子增加;复合液中Sb2+浓度增加也能使表面粗糙度增加,蚀刻因子增加,但是,抗剥离强度基本没有变化。添加CuSO4后,阴极钛辊腐蚀速度下降,当CuSO4质量浓度达到20 g/L后,钛的耐腐蚀速度在0.050 mm/a以下;当钛辊表面粗糙度Rz降低时,电解铜箔表面相对平整,晶粒大小较均匀,排列较规则。

Effects of surface roughness and erosion of titanium cathode drum on performance of electrolytic copper foils and surface images were studied by chemical treatments.The results show that surface roughness and contradict debonding intensity increases and etch factorial（Ef） decreases with the increase of copper concentration and electric current density.When the concentration of copper and zinc of leached compound solution decreases,surface roughness and contradict debonding intensity decreases but etch factorial（Ef） increases.When the concentration of Sb2＋ of leached compound solution increases,surface roughness and contradict debonding intensity increases but etch factorial（Ef） has litter change.The erosion rate of titanium cathode drum decreases when CuSO4 is added.When the mass concentration of CuSO4 is added up to 20 g/L,the erosion rate is less than 0.050 mm/a.Moreover,the surface of electrolytic copper foils is even and the size is well-proportioned and ranks regularly when surface roughness of titanium cathode drum（Rz） decreases.