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加热温度对淬火态Cu-Al合金电阻率的影响 被引量:1

Effect of Heating Temperature on Resistivity of As-quenched Cu-Al Alloy
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摘要 采用电阻率测试仪研究了加热温度对淬火态Cu-Al合金电阻率的影响。结果表明,在25~380℃范围内,Cu-Al合金的电阻率随着温度的升高而增大;当温度从380℃升至473℃时,合金的电阻率变化不大,而随着温度的进一步升高电阻率再次增大。对上述合金电阻率随加热温度的变化进行了初步分析。 The effect of heating temperature on resistivity of as-quenched Cu-Al alloy was investigated by using resistivity tester.The results show that the resistivity of Cu-Al alloy will increase with the elevation of heating tempera-tures from 25 to 380 ℃;and the resistivity has no appreciable variation at the temperatures ranging from 380 to 473 ℃ and will increase once again with the further elevation of heating temperature.The above-mentioned variation of the resistivity of Cu-Al alloy with heating temperature was preliminarily analyzed.
出处 《热处理》 CAS 2011年第1期53-55,共3页 Heat Treatment
关键词 CU-AL合金 淬火 电阻率 温度 Cu-Al alloy quenching resistivity temperature
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  • 1刘喜波,董企铭,刘平,贾淑果,田保红.接触线用Cu-Ag-Cr合金的抗软化性和再结晶研究[J].铸造技术,2004,25(9):713-715. 被引量:6
  • 2崔兰,季小娜,陈小平,丁丽.高强高导纯铜线材及铜基材料的研究进展[J].稀有金属,2004,28(5):917-920. 被引量:38
  • 3罗丰华.高速列车异步牵引电动机转子专用铜合金的研究[M].长沙:中南工业大学,1999..
  • 4[1]Rensei F.Rensei Futatsuka development of copper alloy for leadframe [J].Journal of the Japan Copper and Brass Research Association,1997,36: 25-32.
  • 5[2]Naotsugu I.Behavor of pricipitation and recrystallization affect upon texture of Cu-Cr-Zr alloy [J].Journal of the Japan Copper and Brass Research Association,1993,32: 115-121.
  • 6[3]Motohisa M.High-strength and high-conductivity alloy KLF201 [J].Journal of the Japan Copper and Brass Research Association,1988,27: 93-98.
  • 7[4]Motohisa M.Development trends in new copper alloy for lead-frame [J].Journal of the Japan Copper and Brass Research Association,1990,29: 18-21.
  • 8[5]Motohisa M.Poformence of KFC-SH and KLF194-SHT copper alloys in high-strength and high-conductivity for lead frame [J].Journal of the Japan Copper and Brass Research Association,1990,29: 224-233.
  • 9[7]Hiroshi Y.Cu-Fe-Ti-Mg alloy used in electronical material [J].Journal of the Japan Copper and Brass Research Association,1984,23: 109-115.
  • 10[8]CEN Shu-chuan(陈树).Physical Property of Material(材料物理性能) [M].Shanghai: Shanghai Jiaotong University Press,1999.40.

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