热电器件焊接层热电耦合应力分布特征

Distribution characteristics of thermoelectric coupling stress in the solder layer of thermoelectric devices

对热电器件焊料层的热电耦合应力特征进行了系统的研究,建立了热电发电器件单一材料和分段材料热电支腿结构的仿真模型.利用有限元软件ANSYS分析了焊料性能对热电转换效率的影响以及在两类结构边界条件下焊料层上的应力分布特征,得出了最可能的破坏位置,同时探讨了不同的材料分段对热电转换效率和焊料层可靠性的影响.所得结论对热电发电器件的优化设计和制造具有重要的指导意义.

The effective stress distribution characteristics in the solder layer of the thermoelectric couple and the thermoelectric conversion efficiency of the segmented thermoelectric couple were investigated respectively. The simulation models of single and double-segmented thermoelectric couple were built. Based on tile commercial software ANSYS, tile effective stress distribution characteristics and the thermoelectric conversion efficiency of the two type thermoelectric couples and their hot side plates with different boundary conditions were studied respectively. The thermoelectric conversion efficiency of the segmented thermoelectric couple and the influence of different segment of thermoelectric couple legs on tile thermoelectric conversion efficiency were also studied. All these results are very useful in the optimized design of the thermoelectric structures.