SMA本体聚合的脱挥发份装置

A Devolatilization Device for SMA Bulk Polymerization

把本体聚合得到的聚合熔融物分散成薄层状或微珠状,于一定的温度和真空度下脱除未反应的单体,使达到规定的残留量,必须使用脱挥发份装置。本文结合顺丁橡胶增韧的苯乙烯—马来酸酐(SMA)本体聚合过程研究使用的脱挥发份装置,对熔体温度、真空度、换热管长径比、交联热处理等关链环节作了讨论和比较,在熔体温度260℃、真空度2kPa条件下得到苯乙烯残留量低于600ppm的产品。

To disperse bulk polymerized melt into thin layer or beads, then reduce the unreacted monomer from the melt at a propertemperature and vacuum to a limited residue, a devolatilization device should be used. Based on the study of the devolatiliza-tion device used in the polymerization of cis-butadiene rubber toughened SMA, the melt temperature, vacuum, L/D ratio ofthe heat exchange pipes, and the heat-treatment for the crosslinkage were studied. A product, whose styrene residue was lessthan 600 ppm, could be prepared when the melt temperature was 260℃ and vacuum was 2kPa.