摘要
LED全自动粘片机具有自动化程度高,控制逻辑复杂的特点,介绍了一种高速高精度LED全自动粘片机系统的软件设计方案,通过全面分析系统软件需求,设计了软件结构和控制逻辑,继而成功实现了系统的软件设计,测试证明设备效率高、精度高,运行稳定、可靠。
The LED fully-automatic die bonder is characterized by full automation and complicated control algorithms.This paper introduces a design scheme of the high-speed and high-precision LED fully-automatic die bonder system software,the system software is successfully designed by analyzing the software requirement and designing the structure and control logic,the final test has proved that the equipment is high-efficiency,high-precision,and runs steadily and reliably.
出处
《电子工业专用设备》
2011年第2期30-32,37,共4页
Equipment for Electronic Products Manufacturing
关键词
LED全自动粘片机
软件结构
控制逻辑
LED fully-automatic die bonder
Software structure
Control logic
