摘要
在3C产业中,由于新电子器件的电流密度与功率都越来越高,散热成了一面临的严重问题。电子线路的冷却系统可分为两类,一为钝态的,一为活性的。钝态模式使用外部能源散热,诸如电风扇。相反地,活性模式诸如散热器是不用外部能源散热的,本文介绍了一些散热器材料和用粉末冶金工艺制造的热管与蒸发室。
The heat dissipation has become one major challenges in 3C industries clue to everincreasing high current density and high power in new electronic devices. Cooling systems for electronics are generally classified two categories：Passive and active. The passive mode utilizes external energy to remove heat, such as fan. In contrast, in the active mode, a heat sink （heat pipe or vopor chamber） are used to remove heat without the application of external energy. This paper will introduces some heat sine materials, heat pipe and vapor chamber prepared by PM technology.
出处
《粉末冶金工业》
CAS
北大核心
2011年第1期1-11,共11页
Powder Metallurgy Industry
关键词
粉末冶金
3C产业
热管理
散热器
Powder Metallurgy
3C industries
electronic devices
heat management
heat sine
heat pipe
vapor chamber
