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Hot carrier injection degradation under dynamic stress

Hot carrier injection degradation under dynamic stress
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摘要 In this paper, we have studied hot carrier injection (HCI) different degradations are obtained from the experiment results. under alternant stress. Under different stress modes, The different alternate stresses can reduce or enhance the HC effect, which mainly depends on the latter condition of the stress cycle. In the stress mode A (DC stress with electron injection), the degradation keeps increasing. In the stress modes B (DC stress and then stress with the smMlest gate injection) and C (DC stress and then stress with hole injection under Vg = 0 V and Vd = 1.8 V), recovery appears in the second stress period. And in the stress mode D (DC stress and then stress with hole injection under Vg = -1.8 V and Vd = 1.8 V), as the traps filled in by holes can be smaller or greater than the generated interface states, the continued degradation or recovery in different stress periods can be obtained. In this paper, we have studied hot carrier injection (HCI) different degradations are obtained from the experiment results. under alternant stress. Under different stress modes, The different alternate stresses can reduce or enhance the HC effect, which mainly depends on the latter condition of the stress cycle. In the stress mode A (DC stress with electron injection), the degradation keeps increasing. In the stress modes B (DC stress and then stress with the smMlest gate injection) and C (DC stress and then stress with hole injection under Vg = 0 V and Vd = 1.8 V), recovery appears in the second stress period. And in the stress mode D (DC stress and then stress with hole injection under Vg = -1.8 V and Vd = 1.8 V), as the traps filled in by holes can be smaller or greater than the generated interface states, the continued degradation or recovery in different stress periods can be obtained.
出处 《Chinese Physics B》 SCIE EI CAS CSCD 2011年第3期402-406,共5页 中国物理B(英文版)
基金 supported by the National Key Science and Technology Special Project,China (Grant No. 2008ZX01002-002) the grant from the Major State Basic Research Development Program of China (973 Program,No. 2011CB309606) the Fundamental Research Funds for the Central Universities (Grant No. JY10000904009)
关键词 hot carrier injection alternate stress RECOVERY DEGRADATION hot carrier injection, alternate stress, recovery, degradation
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