铜电极表面电火花沉积碳化钛时涂层的物质过渡趋势

Mass Transferring Trend of TiC Coating on Copper Electrode Surface Deposited by Electrospark

通过记录沉积过程中每隔30 s的涂层质量,探讨了涂层材料转移的基本规律。结果表明,在电火花沉积过程中,涂层的质量呈抛物线状增加,初始沉积速率较高,随后逐渐降低,沉积120 s后趋于稳定。基体材料Cu和熔敷棒材料TiC的气化、熔敷棒的机械切削、热冲击造成脆性涂层的裂纹与分层脱落,是导致涂层沉积速度降低的主要因素。随电火花能量的增加,基体Cu的气化加强,从而减轻了涂层的质量增加,其中电压比电容的影响更明显。电火花制备TiC涂层应使用较高电压,并将沉积时间控制在120 s以内。

The mass transferring trend was discussed by recording the mass of coating every 30 s during deposition.The results indicate that the mass of the coating develops along a parabolic curve.The deposition velocity is higher at the beginning and stabilizes gradually after deposition for 120 s.The deposition velocity is primarily influenced by evaporation of copper and TiC,cutting of the rod,flaking and cracking of the brittle coating.The evaporation will be greater with the increase of pulse energy,which decreases the mass increase of the coating.In order to obtain better coating,higher voltage should be utilized and deposition time should be limited to 120 s.