超声流动镀铜法制备铜包石墨粉

Fabrication of Cu-coated Graphite Powders with Ultrasonic Flow Electroplating Copper

通过超声流动电镀法使铜均匀沉积在微米级鳞片石墨上,从而制得铜包石墨粉.研究了镀铜过程中工艺条件对镀铜效果及铜包石墨粉中铜质量分数的影响.结果表明,利用该工艺可以制备出铜质量分数为50%~75%、且铜镀层致密、连续的复合粉体.用该复合粉体制备了铜-石墨电刷,其导电和磨损性能明显优于石墨粉与铜粉直接混合制备的电刷.

Cu-coated graphite powders were fabricated by ultrasonic flow plating.The effects of electroplating parameters on the copper content in Cu-coated graphite powders were investigated.The results showed that uniform and dense Cu coating was electroplated on graphite powders and there was 50%~75% copper content in Cu-coated graphite powders.Cu-graphite brush was made of Cu-coated graphite powders,which possessed lower resistivity and better wear resistance than that obtained by mixing copper and graphite powders mechanically.