电子封装用低银含量无铅钎料的研究和应用进展

Research and application progress in low-Ag lead-free solder for electronic packaging

电子封装用钎料从传统锡铅合金向无铅钎料的转换过程中适逢手持便携式电子器件高速增长期,加之近年来金属价格的持续上涨,因而低银含量无铅钎料合金作为第二代无铅钎料成为关注的焦点。本文阐述了无铅低银钎料的研究与发展现状,同时分析了其应用情况,最后,对该钎料及其可靠性的发展趋势进行了分析和展望。

The process that the transition of solder for electronic packaging from traditional tin-lead alloy to lead-free solders is just the process that the hand-held and portable electronic devices were developed rapidly,together with continuously increasing of the metal price in recent year,the low-Ag lead-free alloy solder has become the second generation of lead-free solder and the focus of attention.In this paper,the research and development of state-of-the-art lead-free low-Ag solders were reviewed,then the analysis of its application was also carried out,and finally,an outlook on the future development of the solders and reliability were also presented.