摘要
采用超细复合粉末直接烧结和传统W骨架熔渗两种方法制备W-10Cu、W-20Cu合金。研究两种方法制备的合金的致密化、显微组织与导电性能,并重点研究了超细复合粉末短时间内烧结和在高温烧结时的致密化行为。结果表明,超细W-10Cu、W-20Cu复合粉末在1200～1420℃烧结,相对密度均达到了99.1%,致密化与合金中的晶粒度和W-Cu复合粉末中的Cu相成分密切相关。与传统熔渗方法相比,超细复合粉末制备的合金显微组织细小、均匀,而且两者导电性能接近。
The W-10Cu/W-20Cu alloys were prepared by the direct liquid phase sintering of ultrafine composite powders synthesized by sol-spray drying and by traditional copper infiltration of W skeleton.The densification,microstructure and electric conductivity of the alloys fabricated by the two processes were studied,focusing on the densification behavior of the ultrafine composite powders sintered at high temperature with a short holding time.The results show that the density of ultrafine W-10Cu and W-20Cu sintered in the range of 1200～1420℃ is 99.1%.The densification behavior and grain growth are closely related to the Cu content.Compared with the copper infiltration process,the microstructure of the alloys fabricated by the liquid phase sintering is very fine and homogeneous.However,these alloys made by the two process have a nearly same conductivity.
出处
《粉末冶金技术》
CAS
CSCD
北大核心
2011年第1期8-12,共5页
Powder Metallurgy Technology
基金
国家杰出青年基金项目(50925416)
国家自然基金项目(50874122)
国家自然科学基金委员会创新研究群体科学基金项目(50721003)
关键词
W-CU复合材料
超细
致密化行为
微观结构
W-Cu composite materials
ultrafine
densification behavior
microstructure
