摘要
针对半导体器件热通量逐年增长的现象,讨论了1种由热电模块、散热器等集成的散热装置来满足其散热要求。通过在icepak中建立该散热装置的数值模型,从热电模块的冷、热端温度场及热电模块的制冷量和制冷系数,分析工作电流、热电臂面长比和环境温度对其散热性能的影响,从而选择合适的热电模块,并使之在最佳工况下运行,从而优化散热装置的散热性能。
To satisfy the increasing heat flux requirement of semiconductor devices,a kind of integrated radiator was studied which was composed of thermoelectric module,heat sinks and so on.A numerical model of the radiator was established in icepak.The cold and hot end temperature field,refrigerating capacity and coefficient of performance of thermoelectric module were analyzed.The effect on heat dissipation of the operating current,the ratio of the cross-sectional area to the length of thermoelectric element and the ambient temperature were studied.The appropriate thermoelectric module was choosen at the optimum operating condition.The heat dissipation performance of the integrated radiator was optimized.
出处
《低温工程》
CAS
CSCD
北大核心
2011年第1期35-39,共5页
Cryogenics
关键词
热电模块
散热装置
icepak
温度场
散热性能
thermoelectric module
heat dissipation device
icepak
temperature field
heat dissipation performance
