期刊文献+

半固态连接技术现状及展望 被引量:1

Overview and Prospect of Semi-solid Joining Technology
下载PDF
导出
摘要 论述了国内外半固态连接技术的研究现状,重点讨论了各种半固态连接方法的优缺点,展望了外加能量辅助半固态连接技术的应用前景和研究方向。 The research status of semi-solid joining technology, the merits and demerits of semi-solid joining methods were discussed. The future research direction of semi-solid joining technology was forecasted.
出处 《热加工工艺》 CSCD 北大核心 2011年第3期127-130,133,共5页 Hot Working Technology
基金 国家自然科学基金资助项目(50975303) 重庆理工大学科研启动基金(09-60-19)
关键词 半固态连接 研究现状 外加能量 semi-solid joining study status adscititious energy
  • 相关文献

参考文献10

二级参考文献41

  • 1Abhay K, Murty S, Jacob E. Metallurgical analysis of cracks on an aluminum alloy ring used in a satellite separation system[J].Engineering Failure Analysis, 2002, 9:709-719.
  • 2Kitazono K, et al. Solid-state diffusion bonding of closed-cell aluminum foams [J]. Materials Science and Engineering,2002, A327:128-132.
  • 3Shirzadi A A, et al. Interface evolution and bond strength when diffusion bonding materials with stable oxide films[J]. Journal of Surface and Interface Analysis, 2001,31 (7) :609 -618.
  • 4Harvey J, Partridge p G, Lurshay A M. Factor affecting the shear strength of solid state diffusion bonding between silver-coated clad Al-Zn-Mg alloy ( aluminum alloy 7010) [J]. Materials anti Science Engineering, 1986,79 : 191 - 196.
  • 5Nishiguchi. Formation mechanism of liquid phase by reaction diffusion during diffusion bonding[J]. Quar. J. Jpn. Wdd.Soc., 1998,8 (3) :336 -342.
  • 6Huang Y,et al. Diffusion bonding of supcrplastic 7075 aluminum alloy [J]. Materials Science and Engineering, 1999,A266:295 - 302.
  • 7Huang Y,et al. Diffusion bonding of hot rolled 7075 aluminum alloy[J]. Materials Science and Technology, 1998,14.
  • 8Wu Y E, Lo Y L. Surface protection for AA8090 aluminum alloy by diffusion bonding [J]. Theoretical and Applied Fracture Mechanics,2002,38:71 - 79.
  • 9Zmuzi A S, Li H, Dong G. Effects of surface roughness on the diffusion bonding of Al alloy 6061 in air[J]. Materials Science and Engineering, 1999,3.270:244 - 248.
  • 10Assadi H, et al. Modelling of the interface morphology when transient liquid phase diffusion bonding under a temperature gradient [J]. Acta Materialia, 2001,49:31 - 39.

共引文献12

同被引文献12

引证文献1

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部