微孔聚氨酯泡沫超声强化化学镀铜的研究

Ultrasonic enhanced electroless copper plating on microporous polyurethane foam

为研制金属泡沫材料电沉积制备所需的导电泡沫基体，以孔径为0．3mm的微孔聚氨酯泡沫为基体进行化学镀铜新工艺研究。探讨镀液组成、温度、pH及超声强化对化学镀铜工艺的影响，得出化学镀铜优化工艺条件如下：硫酸铜质量浓度为16g／L，酒石酸钾钠质量浓度为30g/L，Na2EDTA质量浓度为20g／L,α,α^1-联吡啶质量浓度为25mg／L，亚铁氰化钾质量浓度为25mg／L，PEG-1000质量浓度为1g／L，甲醛含量为5mL／L，镀液pH为12．5～13．0，温度为50℃。在此条件下，镀液稳定性好，镀层光亮平整，镀速可达0．102mg／min；超声强化可有效提高镀速20％～30％；化学镀铜后的导电泡沫基体经电沉积工艺可制备得到孔隙率为92．2％的三维网状金属泡沫材料。

In order to get good conductive foam substrates for foam metal materials, a novel method for electroless copper plating on microporous polyurethane foam with diameter of 0.3 mm was proposed. The main factors affecting the plating rate such as the solution composition, temperature, pH and adding ultrasonic were investigated comprehensively. The results show that the optimal conditions are 16 g/L CuSO4, 5 mL/L HCHO, 30 g/L NaKCaH406, 20 g/L Na2EDTA, 25 mg/L α,α^1-Dipyridyl, 25 mg/L K4Fe（CN）6, 1 g/L PEG-1000, at pH 12.5-13.0, temperature 50 ~C. Under above conditions, the process has efficient bath stability with the plating rate up to 0.102 mg/min. The result shows that adding ultrasonic on the process can elevate the plating rate of copper by 20%-30%. Foam metal material with a porosity of 92.2%, and a three-dimensional network structure can be fabricated by electrodeposition after electroless copper plating.