摘要
研究了不同酚氧树脂的添加量（0~60%）分别对双氰胺和酚醛树脂固化环氧树脂体系性能的影响。结果表明：随着酚氧树脂添加量的增加,与铜箔的剥离强度、固化物的介电性能、延伸率和吸水率均出现了一定程度的升高,拉伸模量出现了大幅的下降。酚氧树脂在两个体系中的不同添加量并没有对体系5%热失重温度产生影响,但降低了Tg,同时随着添加量的增加出现了两个玻璃化转变点。
The effects of different addition of phenoxy resin（0-60%） on DICY and phenolic resin-cured epoxy resin system were studied.The results show that with the increase of phenoxy resin,the peel strength,dielectric properties,elongation and water absorption increase to some extent,and tensile modulus decreases dramatically.At the same time,the phenoxy resin does not affect the system＇s 5% weight loss temperature,but lower Tg and two glass transition points come out.
出处
《绝缘材料》
CAS
北大核心
2011年第1期55-57,共3页
Insulating Materials
关键词
酚氧树脂
酚醛树脂
双氰胺
环氧树脂
phenoxy resin
phenolic resin
dicyandiamide（DICY）
epoxy resin
