摘要
采用印制电路板级集成电路进行剪切试验,对比了十组使用不同粘结材料及不同点胶方式的薄型球栅阵列封装(TCBGA)组件和一组未使用粘结材料的组件的剪切特性。结果表明,这些粘结材料均不同程度地提高了组件的剪切强度,其中底部部分和完全填充点胶方式效果较佳,相对于无粘结材料,组件所能承受的最大剪切力分别提升了87.51%和53.41%。且随着粘结材料使用量的增加,失效位置呈现从强度较弱的PCB焊盘-基板界面向较强的元件焊盘-焊球界面转移的趋势。
Printed circuit board-level integrated circuit shear test was used to compare the shear properties of ten groups of thin core ball grid array（TCBGA） assemblies with different adhesives and different dispensing patterns and one group assemblies without the adhesive.Results indicate that all the adhesives can improve the shear strength of assemblies in different extents,especially the adhesives with partial and full underfill dispensing patterns,compared to the assembly without adhesive,maximum shear forces of assemblies with them increase by 87.51% and 53.41%,respectively.And the failure locations change from weaker PCB pad-substrate to stronger component pad-solder joint interface with the use amount of adhesives increasing gradually.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2011年第4期45-49,共5页
Electronic Components And Materials
