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化学镀Ni-Cu-P工艺及性能研究

A Study of Electroless Ni-Cu-P Process and Properties
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摘要 三元合金可以进一步提高Ni-P镀层的性能。在化学镀Ni-P基础镀液中加入CuSO4,考察了CuSO4对镀层沉积速率、表面相貌、显微硬度以及耐蚀性能的影响。结果表明:CuSO4提高了Ni-P镀层的沉积速率,减少了镀层表面的缺陷,改善了镀层的致密性和光亮度,提高了镀层的耐蚀性。 Ternary alloys can further improve the properties of Ni-P coating.CuSO_4 was added to basic electroless Ni-P plating bath,and the effects of CuSO_4 on the deposition rate,morphology,micro-hardness and corrosion resistance of the coating were investigated.The results show that CuSO_4 can raise the deposition rate,reduce surface defects and improve compactness and brightness of Ni-P coating,thus the corrosion resistance of the coating is improved.
作者 张云霞
出处 《电镀与环保》 CAS CSCD 北大核心 2011年第2期18-19,共2页 Electroplating & Pollution Control
关键词 化学镀 硫酸铜 耐蚀性 electroless plating copper sulfate corrosion resistance
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参考文献4

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