摘要
提出一种基于De Bruijn图的新型三维片上网络架构方式,利用De Bruijn图直径短、路由简单及容错等特性,实现三维片上网络水平面网络和虚平面网络相结合的分层架构与容错路由算法。利用仿真,在均匀流量和热点流量模型下将该架构与传统架构进行仿真与性能比较,结果表明,与传统的3D_Mesh、XNoTs等架构相比,基于De Bruijn图的三维片上网络架构方式具有较小的网络平均延时与良好的可扩展性。
Since the three dimensional (3D) integrated circuit (IC) can offer shorter intercotmection wire for network on chip (NoC), 3D NoC becomes an emerging research area in recent years. This paper proposes a new architecture based on De Bruijn graph for 3D NoC. It makes use of advantages of Dc Bruijn graph, such as small diameter, simple routing, and high reliability to design a hybrid layering architecture combined by horizontal planer network and virtual horizontal planer network. It also adopts fault-tolerant routing algorithm. This paper compares the performance of the proposed architecture with traditional 3D NoC architectures like 3D Mesh and XNoTs under uniform traffic and hotspot traffic. The simulation results prove that the De Bruijn graph based architecture can achieve smaller network latency than 3D Mesh based architectures with good scalability.
出处
《电子科技大学学报》
EI
CAS
CSCD
北大核心
2011年第2期204-209,共6页
Journal of University of Electronic Science and Technology of China
基金
国家863项目(2007AA01Z291)
教育部博士点基金新教师基金(200806141015)
关键词
三维集成电路
架构
网络延时
片上网络
功耗
3D integrated circuits
architecture
network latency
network on chip
power