高精度大尺寸硅晶片的双面研磨抛光机改进设计

Upgrading Design of High-Precision Double-Sided Grinding and Polishing Machine for Large-Size Silicon Wafer

随着IC设计技术和制造技术的发展和进步,集成电路芯片的集成度在不断提高,芯片密度呈指数增长趋势。硅晶片作为集成电路芯片的主要材料,尺寸越来越大。在分析国内双面抛光机典型机型原理和特点的基础上,针对运用于大尺寸甚至是直径400 mm的硅晶片,提出高精度双面研磨抛光机在机械结构和控制系统等方面的改进措施,很好地解决了国内目前对大尺寸硅晶片加工难、加工精度不高等难题。

With the development and upgrading of IC design and manufacturing technology,integrated circuit chip＇s integration and density also rise exponentialy.The size is growing as silicon wafer is the main material of integrated circuit chip.Based on the analysis of China double-sided grinding and polishing machine＇s principle and characteristics of the typical models,for used the large-size even 400 mm diameter silicon wafers,upgraded high-precision double-sided grinding and polishing machine in the mechanical structure and control system.Present a good solution to the difficulties in large-size processing and high precision.