摘要
利用基于SU-8光刻胶的UV-LIGA技术加工微细金结构。针对所沉积的微结构出现凹形的现象,建立了加工过程的电场数学模型,利用有限元方法对这种现象进行仿真研究,发现当光刻胶厚度大于微结构厚度时,可以明显改善这种情况。另外,试验还研究了阴阳极距离、电流密度对沉积层表面平整度的影响。优化参数组合,最终制备出厚度0.2 mm的微细金结构。
Gold micro-structure is fabricated by means of UV-LIGA technique which based on SU-8 photoresist. The deposited micro-structure is naturally a concave shape over the whole area. The distribution of deposited layer thickness is analyzed on the basis of the electric field mathematical mod- el. The simulation results show that when the photoresist thicker than micro-structure thickness can significantly improve the situation. In addition, the influences of distance between anode and cathode, current density are studied by experiment. Finally,the micro-structure of 200urn thick are obtained by the optimized parameters.
出处
《电加工与模具》
2011年第B04期42-45,共4页
Electromachining & Mould
